HEATSINK 40X40X25MM L-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
342000F00000GAavid |
HEATSINK |
![]() |
322805B00000GAavid |
BOARD LEVEL HEAT SINK |
![]() |
508222B00000Aavid |
BOARD LEVEL HEAT SINK |
![]() |
528-45AB-MEWakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
![]() |
ATS-15G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
657-20ABPESCWakefield-Vette |
HEATSINK TO-220 W/PINS BLK 2" |
![]() |
ATS-EXL103-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X179X33.6MM |
![]() |
ATS-54290R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 29X29X19.5MM W/OUT TIM |
![]() |
TGH-0380-05t-Global Technology |
ALUMINIUM HEAT SINK 38X38MM |
![]() |
624-60ABT4EWakefield-Vette |
HEATSINK FOR 21MM BGA |
![]() |
ATS-15D-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
669-33ABWakefield-Vette |
HEATSINK ASSY FOR SPGA |
![]() |
HSIB903-BGA-2iBASE Technology |
AC, HEAT SPREADER FOR IB903F / I |