Type | Description |
---|---|
Series: | 301 |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | Stud Mounted Semiconductor Cases |
Attachment Method: | Press Fit |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 0.750" (19.05mm) |
Diameter: | - |
Fin Height: | 2.000" (50.80mm) |
Power Dissipation @ Temperature Rise: | 15.0W @ 70°C |
Thermal Resistance @ Forced Air Flow: | 2.50°C/W @ 250 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
TGH-0510-02t-Global Technology |
ALUMINIUM HEAT SINK 100X51MM |
![]() |
260-4TH5EWakefield-Vette |
CUP CLIP TRANSISTOR C3488 REV H |
![]() |
ATS-51350K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 35X35X14.5MM W/OUT TIM |
![]() |
ATS-16G-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
FHSA5015B-1672Delta Electronics / Fans |
HEATSINK |
![]() |
ATS-03B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
4-1542003-4TE Connectivity AMP Connectors |
42.5MMHS ASSY ULTEM C |
![]() |
ATS-52300P-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 30X30X17.5MM W/OUT TIM |
![]() |
500303B00000GAavid |
BOARD LEVEL HEAT SINK |
![]() |
ATS-55210D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X9.5MM W/OUT TIM |
![]() |
ATS-16C-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
C247-175-4AEOhmite |
175MM LG BLK ANODIZED HEATSINK |
![]() |
TGH-0280-08t-Global Technology |
ALUMINIUM HEAT SINK 28X28MM |