HEATSINK 40X40X25MM L-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.39°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
TMPBU-19945Delta Electronics / Fans |
HEATSINK |
![]() |
6-1542003-8TE Connectivity AMP Connectors |
HS ASSY CLIP |
![]() |
634-20ABWakefield-Vette |
HEATSINK TO-220 VERT MT BLK 2.0" |
![]() |
628-20ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
![]() |
628-65ABT4EWakefield-Vette |
HEATSINK FOR 45MM BGA |
![]() |
ATS-17H-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
642-35ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
![]() |
ATS-13B-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
ATS-52325G-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X12.5MM NO TIM |
![]() |
628-25ABT5Wakefield-Vette |
HEATSINK FOR 45MM BGA |
![]() |
TGH-0300-01t-Global Technology |
ALUMINIUM HEAT SINK 30X30MM |
![]() |
132-4.5BWakefield-Vette |
HEATSINK EXTRUDED |
![]() |
658-45ABT6Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |