HEATSINK 40X40X25MM L-TAB T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
5022NGAavid |
HEATSINK |
![]() |
518-95AB-MT725Wakefield-Vette |
HEATSINK DC/DC HALF BRICK VERT |
![]() |
ATS-14D-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-17A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
ATS-12E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
HSET950-BGA-1iBASE Technology |
HEATSINK WITH COOLER FOR ET950 & |
![]() |
ATS-EXL7-1220-R0Advanced Thermal Solutions, Inc. |
HEATSINK AL6063 1220X101X14MM |
![]() |
628-25ABT3Wakefield-Vette |
HEATSINK FOR 45MM BGA |
![]() |
TGH-0550-01t-Global Technology |
ALUMINIUM HEAT SINK 55X55MM |
![]() |
ATS-50350B-C0-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 35MM X 35MM X 7.5MM |
![]() |
ATS-52150G-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 15X15X12.5MM W/OUT TIM |
![]() |
658-60ABT6Wakefield-Vette |
HEATSINK EXTRUSION 27MM |
![]() |
TGH-0955-01t-Global Technology |
ALUMINIUM HEAT SINK 95.5X95MM |