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630-60AB

630-60AB

HEATSINK FOR BGA 35MM

630-60AB

630-60AB

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Part No :

630-60AB

Manufacturer
Wakefield-Vette
Description
HEATSINK FOR BGA 35MM
Catalog
Thermal - Heat Sinks
Availability
505350 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 10 - Feb 14 2025
PDF
630-60AB PDF
Type Description
Series:630
Package:Bulk
Part Status:Active
Type:Top Mount
Package Cooled:BGA
Attachment Method:Thermal Tape, Adhesive (Not Included)
Shape:Square, Pin Fins
Length:1.378" (35.00mm)
Width:1.378" (35.00mm)
Diameter:-
Fin Height:0.598" (15.20mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:3.00°C/W @ 350 LFM
Thermal Resistance @ Natural:-
Material:Aluminum
Material Finish:Black Anodized
630-60AB is available at GangBo-ic.com, Please review product page below for detailed information, including 630-60AB price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 630-60AB to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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