HEATSINK 40X40X25MM XCUT T766
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Tray |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | - |
Fin Height: | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
ATS-07D-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-17E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
ATS-08B-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
1-1542005-2TE Connectivity AMP Connectors |
21MM HS ASSY ULTEM CL |
|
ATS-55210R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 21X21X19.5MM W/OUT TIM |
|
537-45ABWakefield-Vette |
HEATSINK DC/DC QUARTER BRICK |
|
413FWakefield-Vette |
HEATSINK POWER TO-3 |
|
ATS-07A-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
533522B02552GAavid |
BOARD LEVEL HEAT SINK |
|
TXB2P045037BCTS Corporation |
THERMAL LINK PRESS ON BLK TO-8 |
|
625-45ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
|
ATS-13F-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
HSIB903-BGAiBASE Technology |
AC, HEATSINK + FAN FOR IB903F/ I |