Type | Description |
---|---|
Series: | 302 |
Package: | Bulk |
Part Status: | Active |
Type: | Board Level, Vertical |
Package Cooled: | Stud Mounted Semiconductor Cases |
Attachment Method: | Press Fit |
Shape: | Rectangular, Fins |
Length: | 2.000" (50.80mm) |
Width: | 1.500" (38.10mm) |
Diameter: | - |
Fin Height: | 2.000" (50.80mm) |
Power Dissipation @ Temperature Rise: | 15.0W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 1.80°C/W @ 250 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
![]() |
907-33-1-18-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 33X33MM CLIP |
![]() |
HSIB905-PGA-1iBASE Technology |
AC, HEATSPEADER FOR IB905F, (ROH |
![]() |
335814B00000GAavid |
HEAT SINK |
![]() |
ATS-18B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
![]() |
ATS-11H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
ATS-10B-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
680-5220Wakefield-Vette |
HEATSINK TO-220 OMNIDIRECT BLK |
![]() |
PICOHEATSINKKITTechNexion |
PICO HEATSINK + THERMAL PAD + SC |
![]() |
ATS-55330R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 33X33X19.5MM W/OUT TIM |
![]() |
ATS-17B-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
624-60ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
![]() |
321127B00000Aavid |
BOARD LEVEL HEAT SINK |
![]() |
908-35-2-28-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 35X35MM CLIP |