HEATSINK 42.5X42.5X9.5MM NO TIM
Type | Description |
---|---|
Series: | - |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Pin Fins |
Length: | 1.673" (42.50mm) |
Width: | 1.673" (42.49mm) |
Diameter: | - |
Fin Height: | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.20°C/W @ 200 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
AH00119V02750CEOhmite |
HEATSINK, FLAT BACK 2.75" |
|
ATS-18B-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
901-19-2-15-2-B-0Wakefield-Vette |
HEAT SINK PIN FIN 19X19MM CLIP |
|
ATS-10H-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
TGH-0250-01t-Global Technology |
ALUMINIUM HEAT SINK 25X25MM |
|
ATS-20E-116-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
HSIB898-BGA-1iBASE Technology |
AC, HEAT SPREADER FOR IB898, (RO |
|
ATS-X51230R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 22.25X22.25X19.5MM T766 |
|
529901B00000Aavid |
BOARD LEVEL HEAT SINK |
|
341900F00000GAavid |
HEATSINK |
|
2-1542006-3TE Connectivity AMP Connectors |
HS 21MM ASSY ULTEM CL |
|
519903B00000GAavid |
BOARD LEVEL HEAT SINK |
|
ATS-54310D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 31X31X9.5MM W/OUT TIM |