RES 17.4K OHM 0.1% 1/4W 1206
THERM PAD 406.4MMX203.2MM VIOLET
HEATSINK 25X25X20MM L-TAB T412
Type | Description |
---|---|
Series: | pushPIN™ |
Package: | Bulk |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | - |
Fin Height: | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Material Finish: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
HSE-B381-045HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38 |
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