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BDN15-3CB/A01

BDN15-3CB/A01

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Part No :

BDN15-3CB/A01

Manufacturer
CTS Corporation
Description
HEATSINK CPU W/ADHESIVE 1.51"SQ
Catalog
Thermal - Heat Sinks
Availability
028102 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 26 - Mar 02 2025
PDF
BDN15-3CB/A01 PDF
Type Description
Series:BDN
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Pin Fins
Length:1.510" (38.35mm)
Width:1.510" (38.35mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:4.50°C/W @ 400 LFM
Thermal Resistance @ Natural:15.10°C/W
Material:Aluminum
Material Finish:Black Anodized
BDN15-3CB/A01 is available at GangBo-ic.com, Please review product page below for detailed information, including BDN15-3CB/A01 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BDN15-3CB/A01 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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