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BDN09-3CB

BDN09-3CB

HEATSINK CPU .91" SQ

BDN09-3CB

BDN09-3CB

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Part No :

BDN09-3CB

Manufacturer
CTS Corporation
Description
HEATSINK CPU .91" SQ
Catalog
Thermal - Heat Sinks
Availability
11553 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 25 - Nov 29 2024
Type Description
Series:BDN
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Not Included)
Shape:Square, Pin Fins
Length:0.910" (23.11mm)
Width:0.910" (23.11mm)
Diameter:-
Fin Height:0.355" (9.02mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:9.60°C/W @ 400 LFM
Thermal Resistance @ Natural:26.90°C/W
Material:Aluminum
Material Finish:Black Anodized
BDN09-3CB is available at GangBo-ic.com, Please review product page below for detailed information, including BDN09-3CB price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BDN09-3CB to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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