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HSE-B630-04H

HSE-B630-04H

HEAT SINK, EXTRUSION, TO-220, 63

MX25L1606EPI-12G

MX25L1606EPI-12G

IC FLASH 16MBIT SPI 86MHZ 8DIP

HSE-B630-04H

HSE-B630-04H

Image is for reference, please contact us to get the real picture

Part No :

HSE-B630-04H

Manufacturer
CUI Devices
Description
HEAT SINK, EXTRUSION, TO-220, 63
Catalog
Thermal - Heat Sinks
Availability
289628 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 19 - Feb 23 2025
PDF
HSE-B630-04H PDF
Type Description
Series:HSE
Package:Box
Part Status:Active
Type:Board Level, Vertical
Package Cooled:TO-220
Attachment Method:PC Pin
Shape:Rectangular, Fins
Length:2.480" (63.00mm)
Width:1.378" (35.00mm)
Diameter:-
Fin Height:1.000" (25.40mm)
Power Dissipation @ Temperature Rise:14.4W @ 75°C
Thermal Resistance @ Forced Air Flow:2.31°C/W @ 200 LFM
Thermal Resistance @ Natural:9.37°C/W
Material:Aluminum Alloy
Material Finish:Black Anodized
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GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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