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BGAH325-075E

BGAH325-075E

BGA HEATSINK W/TAPE

BGAH325-075E

BGAH325-075E

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Part No :

BGAH325-075E

Manufacturer
Ohmite
Description
BGA HEATSINK W/TAPE
Catalog
Thermal - Heat Sinks
Availability
178417 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 28 - Dec 02 2024
Type Description
Series:BG
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:BGA, CPU, GPU
Attachment Method:Thermal Tape, Adhesive (Included)
Shape:Square, Angled Fins
Length:1.279" (32.50mm)
Width:1.279" (32.50mm)
Diameter:-
Fin Height:0.295" (7.50mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:6.00°C/W
Material:Aluminum Alloy
Material Finish:Black Anodized
BGAH325-075E is available at GangBo-ic.com, Please review product page below for detailed information, including BGAH325-075E price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BGAH325-075E to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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