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ATS-UC-QFLOW-200

ATS-UC-QFLOW-200

QUADFLOW HEATSINK 1U CU FINS

ATS-UC-QFLOW-200

ATS-UC-QFLOW-200

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Part No :

ATS-UC-QFLOW-200

Manufacturer
Advanced Thermal Solutions, Inc.
Description
QUADFLOW HEATSINK 1U CU FINS
Catalog
Thermal - Heat Sinks
Availability
356935 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 13 - Nov 17 2024
Type Description
Series:quadFLOW™
Package:Box
Part Status:Active
Type:Top Mount, Zipper Fin
Package Cooled:Intel LGA2011 & LGA2066 CPU Cooler
Attachment Method:Push Pin
Shape:Square, Fins
Length:3.637" (92.38mm)
Width:3.626" (92.11mm)
Diameter:-
Fin Height:1.142" (29.00mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:-
Thermal Resistance @ Natural:-
Material:Copper
Material Finish:Nickel
ATS-UC-QFLOW-200 is available at GangBo-ic.com, Please review product page below for detailed information, including ATS-UC-QFLOW-200 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for ATS-UC-QFLOW-200 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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