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APF30-30-10CB

APF30-30-10CB

HEATSINK LOW-PROFILE FORGED

APF30-30-10CB

APF30-30-10CB

Image is for reference, please contact us to get the real picture

Part No :

APF30-30-10CB

Manufacturer
CTS Corporation
Description
HEATSINK LOW-PROFILE FORGED
Catalog
Thermal - Heat Sinks
Availability
10281 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 01 - Dec 05 2024
PDF
APF30-30-10CB PDF
Type Description
Series:APF
Package:Box
Part Status:Active
Type:Top Mount
Package Cooled:Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:Thermal Tape, Adhesive (Not Included)
Shape:Square, Fins
Length:1.181" (30.00mm)
Width:1.181" (30.00mm)
Diameter:-
Fin Height:0.370" (9.40mm)
Power Dissipation @ Temperature Rise:-
Thermal Resistance @ Forced Air Flow:3.30°C/W @ 200 LFM
Thermal Resistance @ Natural:-
Material:Aluminum
Material Finish:Black Anodized
APF30-30-10CB is available at GangBo-ic.com, Please review product page below for detailed information, including APF30-30-10CB price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for APF30-30-10CB to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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