PMI BASE 11/16 NEON BAY SOLDER
NON-SAG 5 MINUTE BONDATHERM EPOX
Type | Description |
---|---|
Series: | BondaTherm™ |
Package: | Bulk |
Part Status: | Active |
Type: | Epoxy, 2 Part |
Size / Dimension: | 50 ml Cartridges |
Usable Temperature Range: | -58°F ~ 266°F (-50°C ~ 130°C) |
Color: | Clear |
Thermal Conductivity: | - |
Features: | - |
Shelf Life: | 36 Months |
Storage/Refrigeration Temperature: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
A16086-01Laird - Performance Materials |
TGREASE 980 0.5 KG |
|
TG-NSP35LV-4OZt-Global Technology |
NON-SILICONE THERMAL PUTTY 4OZ L |
|
65-02-GEL45-0180Parker Chomerics |
THERM-A-GAP GEL45 180CC EFD SYR |
|
GF1500-00-60-50CCHenkel / Bergquist |
GF1500 50CC DUAL CARTRIDGE |
|
1695226LOCTITE / Henkel |
TCP 4000 55CC EFD EN/CH |
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65-00-GEL30-0010Parker Chomerics |
THERM-A-GAP GEL30 3.5W/M-K 10CC |
|
GCS-NSP15-100ML |
NON SIL PUTTY, 1.5W/MK, 100ML |
|
8329TFF-50MLMG Chemicals |
FAST CURE THERM COND ADH FLOW |
|
TG-NSP80-1LBt-Global Technology |
NON-SILICONE PUTTY 1LB GREY |
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21086Ellsworth Adhesives |
THERMAL ADHESIVE GRAY 25ML KIT |
|
S606P-50t-Global Technology |
SILICONE THERMAL GREASE 50G JAR |
|
65-02-GEL30-0180Parker Chomerics |
THERM-A-GAP GEL30 180CC |
|
NTE424NTE Electronics, Inc. |
1 OZ HEAT SINK COMPOUND |