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522-AG11D

522-AG11D

CONN IC DIP SOCKET 22POS GOLD

522-AG11D

522-AG11D

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Part No :

522-AG11D

Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 22POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
743674 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 25 - Mar 01 2025
Type Description
Series:500
Package:Bulk
Part Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):22 (2 x 11)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Brass, Copper
Housing Material:Polyester
Operating Temperature:-55°C ~ 125°C
522-AG11D is available at GangBo-ic.com, Please review product page below for detailed information, including 522-AG11D price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 522-AG11D to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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