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SIP1X21-011BLF

SIP1X21-011BLF

CONN SOCKET SIP 21POS GOLD

SIP1X21-011BLF

SIP1X21-011BLF

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Part No :

SIP1X21-011BLF

Manufacturer
Storage & Server IO (Amphenol ICC)
Description
CONN SOCKET SIP 21POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
133513 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 02 - Dec 06 2024
PDF
SIP1X21-011BLF PDF
Type Description
Series:SIP1x
Package:Bulk
Part Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):21 (1 x 21)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
SIP1X21-011BLF is available at GangBo-ic.com, Please review product page below for detailed information, including SIP1X21-011BLF price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SIP1X21-011BLF to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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