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818-AG11SM

818-AG11SM

CONN IC DIP SOCKET 18POS GOLD

818-AG11SM

818-AG11SM

Image is for reference, please contact us to get the real picture

Part No :

818-AG11SM

Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 18POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
763476 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 20 - Feb 24 2025
Type Description
Series:800
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:-
Contact Material - Mating:Copper Alloy
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:-
Contact Material - Post:Copper Alloy
Housing Material:Thermoplastic, Polyester
Operating Temperature:-
818-AG11SM is available at GangBo-ic.com, Please review product page below for detailed information, including 818-AG11SM price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 818-AG11SM to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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