Type | Description |
---|---|
Series: | Diplomate DL |
Package: | Box |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Phosphor Bronze |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Phosphor Bronze |
Housing Material: | Thermoplastic, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
0784990002Woodhead - Molex |
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400-040-0003M |
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MVAS-114-ZSGT-13Samtec, Inc. |
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D01-9972342Harwin |
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1814640-6TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 6POS GOLD |
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D0828-42Harwin |
CONN IC DIP SOCKET 28POS GOLD |
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8080-1G16TE Connectivity AMP Connectors |
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215-1-08-003CnC Tech |
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245-22-1-03CnC Tech |
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210227-4TE Connectivity AMP Connectors |
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2320-9220-02-24013M |
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