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824-AG66D

824-AG66D

CONN IC DIP SOCKET 24POS GOLD

824-AG66D

824-AG66D

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Part No :

824-AG66D

Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 24POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
173117 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 26 - Nov 30 2024
PDF
824-AG66D PDF
Type Description
Series:800
Package:Bulk
Part Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):24 (2 x 12)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin-Lead
Contact Finish Thickness - Post:80.0µin (2.03µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyester
Operating Temperature:-55°C ~ 105°C
824-AG66D is available at GangBo-ic.com, Please review product page below for detailed information, including 824-AG66D price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 824-AG66D to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

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