SIP050-1X26-157BLF

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Part No :: SIP050-1X26-157BLF

Manufacturer: Storage & Server IO (Amphenol ICC)

Description: CONN SOCKET SIP 26POS TIN

Catalog: Sockets for ICs, Transistors

Availability: 922892 pieces

Shipped from: HK warehouse

Expected Shipping Date: Nov 24 - Nov 28 2024

PDF: SIP050-1X26-157BLF PDF

Type	Description
Series:	SIP050-1x
Package:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	26 (1 x 26)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:	-

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GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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