BGA SOLDER TAIL
Type | Description |
---|---|
Series: | 550 |
Package: | Bulk |
Part Status: | Active |
Type: | BGA |
Number of Positions or Pins (Grid): | 255 (16 x 16) |
Pitch - Mating: | 0.050" (1.27mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Brass |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.050" (1.27mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | FR4 Epoxy Glass |
Operating Temperature: | -55°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
14-8510-10WRAries Electronics, Inc. |
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110-83-952-41-005101Preci-Dip |
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317-93-103-41-005000Mill-Max |
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515-13-121-11-000002Mill-Max |
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BGA SOLDER TAIL |
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510-93-109-12-051003Mill-Max |
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16-C195-31Aries Electronics, Inc. |
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126-41-210-41-001000Mill-Max |
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612-43-648-41-003000Mill-Max |
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