CAP FILM 0.03UF 5% 630VDC RADIAL
CONN SOCKET PGA ZIF GOLD
Type | Description |
---|---|
Series: | PLS |
Package: | Bulk |
Part Status: | Active |
Type: | PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid): | - |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyphenylene Sulfide (PPS) |
Operating Temperature: | -65°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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