RES 3.09K OHM 0.5% 1/4W 1206
RES 62 OHM 2% 1W AXIAL
CONN IC DIP SOCKET 18POS GOLD
FIXED IND 3.3MH 140MA 8.5 OHM TH
Type | Description |
---|---|
Series: | - |
Package: | Tube |
Part Status: | Obsolete |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 18 (2 x 9) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Thermoplastic, Polyester |
Operating Temperature: | -40°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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