MEMS OSC XO 4.0000MHZ H/LV-CMOS
CONN IC DIP SOCKET 20POS GOLD
CONN PLUG FMALE 19P SOLDER CUP
CBL 2COND 20AWG
Type | Description |
---|---|
Series: | 121 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.4" (10.16mm) Row Spacing |
Number of Positions or Pins (Grid): | 20 (2 x 10) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
10-9513-10TAries Electronics, Inc. |
CONN IC DIP SOCKET 10POS GOLD |
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CONN IC DIP SOCKET 20POS GOLD |