CAP CER 470PF 6KV X7R 1812
CONN HDR 34POS SMD GOLD
CONN IC DIP SOCKET 28POS GOLD
IC FPGA 168 I/O 256UBGA
Type | Description |
---|---|
Series: | 800 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.6" (15.24mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 25.0µin (0.63µm) |
Contact Material - Mating: | Copper Alloy |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 80.0µin (2.03µm) |
Contact Material - Post: | Copper Alloy |
Housing Material: | Polyester |
Operating Temperature: | -55°C ~ 105°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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