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808-AG11D-LF

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808-AG11D-LF

808-AG11D-LF

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Part No :

808-AG11D-LF

Manufacturer
TE Connectivity AMP Connectors
Description
CONN IC DIP SOCKET 8POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
13714 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 19 - Feb 23 2025
PDF
808-AG11D-LF PDF
Type Description
Series:800
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:25.0µin (0.63µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:25.0µin (0.63µm)
Contact Material - Post:Copper
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature:-55°C ~ 105°C
808-AG11D-LF is available at GangBo-ic.com, Please review product page below for detailed information, including 808-AG11D-LF price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 808-AG11D-LF to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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