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28-6554-11

28-6554-11

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Part No :

28-6554-11

Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET ZIF 28POS GLD
Catalog
Sockets for ICs, Transistors
Availability
10850 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 15 - Nov 19 2024
PDF
28-6554-11 PDF
Type Description
Series:55
Package:Bulk
Part Status:Active
Type:DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid):28 (2 x 14)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:-
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:-
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-
28-6554-11 is available at GangBo-ic.com, Please review product page below for detailed information, including 28-6554-11 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 28-6554-11 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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