CONN SOCKET SOIC 28POS GOLD
Type | Description |
---|---|
Series: | Textool™ |
Package: | Bulk |
Part Status: | Active |
Type: | SOIC |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polyethersulfone (PES), Glass Filled |
Operating Temperature: | -55°C ~ 150°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
940-44-052-17-400000Mill-Max |
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115-87-324-41-001101Preci-Dip |
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280-5205-013M |
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210-43-632-41-001000Mill-Max |
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110-44-314-41-001000Mill-Max |
CONN IC DIP SOCKET 14POS TIN |
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840-AG11D-ESL-LFTE Connectivity AMP Connectors |
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116-87-640-41-002101Preci-Dip |
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217-87-764-41-005101Preci-Dip |
DIL SOLDER TAIL 1.778MM |