CONN IC DIP SOCKET 28POS GOLD
Type | Description |
---|---|
Series: | 116 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.4" (10.16mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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28-823-90CAries Electronics, Inc. |
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299-87-610-10-002101Preci-Dip |
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116-83-632-41-003101Preci-Dip |
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115-93-308-41-003000Mill-Max |
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116-83-422-41-003101Preci-Dip |
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123-47-308-41-001000Mill-Max |
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|
116-87-610-41-012101Preci-Dip |
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115-93-324-41-003000Mill-Max |
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4814-3000-CP3M |
CONN IC DIP SOCKET 14POS TIN |