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RS73G1JTTD1470D

RS73G1JTTD1470D

RES 147 OHM 0.5% 1/5W 0603

18-8750-310C

18-8750-310C

CONN IC DIP SOCKET 18POS GOLD

4HF106250Z4AACXGI

4HF106250Z4AACXGI

MEMS OSC XO 106.2500MHZ LVDS SMD

18-8750-310C

18-8750-310C

Image is for reference, please contact us to get the real picture

Part No :

18-8750-310C

Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 18POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
891989 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 28 - Dec 02 2024
PDF
18-8750-310C PDF
Type Description
Series:8
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Elevated
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C
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