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BU200Z-178-HT

BU200Z-178-HT

CONN IC DIP SOCKET 20POS GOLD

BU200Z-178-HT

BU200Z-178-HT

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Part No :

BU200Z-178-HT

Manufacturer
On-Shore Technology, Inc.
Description
CONN IC DIP SOCKET 20POS GOLD
Catalog
Sockets for ICs, Transistors
Availability
11041 pieces
Shipped from
HK warehouse
Expected Shipping Date
Feb 23 - Feb 27 2025
PDF
BU200Z-178-HT PDF
Type Description
Series:BU-178HT
Package:Bulk
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):20 (2 x 10)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:78.7µin (2.00µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Surface Mount
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Copper
Contact Finish Thickness - Post:Flash
Contact Material - Post:Brass
Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature:-55°C ~ 125°C
BU200Z-178-HT is available at GangBo-ic.com, Please review product page below for detailed information, including BU200Z-178-HT price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for BU200Z-178-HT to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

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