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DILB8P-223TLF

DILB8P-223TLF

CONN IC DIP SOCKET 8POS TIN

DILB8P-223TLF

DILB8P-223TLF

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Part No :

DILB8P-223TLF

Manufacturer
Storage & Server IO (Amphenol ICC)
Description
CONN IC DIP SOCKET 8POS TIN
Catalog
Sockets for ICs, Transistors
Availability
16703 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 27 - Dec 31 2024
PDF
DILB8P-223TLF PDF
Type Description
Series:-
Package:Tube
Part Status:Active
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):8 (2 x 4)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:100.0µin (2.54µm)
Contact Material - Mating:Copper Alloy
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:100.0µin (2.54µm)
Contact Material - Post:Copper Alloy
Housing Material:Polyamide (PA), Nylon
Operating Temperature:-55°C ~ 105°C
DILB8P-223TLF is available at GangBo-ic.com, Please review product page below for detailed information, including DILB8P-223TLF price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for DILB8P-223TLF to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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