B401 10X14 ANSI RED,BLK/WHT SMKN
MINI MEGAPAC
CONN SOCKET 11POS 0.1 GOLD PCB
IC FPGA 93 I/O 144TQFP
Type | Description |
---|---|
Series: | ESW |
Package: | Tube |
Part Status: | Active |
Connector Type: | Elevated Socket |
Contact Type: | Forked |
Style: | Board to Board |
Number of Positions: | 11 |
Number of Positions Loaded: | All |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Rows: | 1 |
Row Spacing - Mating: | - |
Mounting Type: | Through Hole |
Termination: | Kinked Pin, Solder |
Fastening Type: | Push-Pull |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
Insulation Color: | Black |
Insulation Height: | 0.435" (11.05mm) |
Contact Length - Post: | 0.090" (2.29mm) |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Contact Finish - Post: | Gold |
Mated Stacking Heights: | - |
Ingress Protection: | - |
Features: | - |
Current Rating (Amps): | 5.2A per Contact |
Voltage Rating: | 550VAC |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
76314-115LFStorage & Server IO (Amphenol ICC) |
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