COOLX POWER SUPPLY
CONN HEADER R/A 3POS 10MM
CONN SOCKET 23P 0.1 GOLD SMD R/A
IC FPGA 552 I/O 1152FBGA
Type | Description |
---|---|
Series: | 310 |
Package: | Bulk |
Part Status: | Active |
Connector Type: | Socket |
Contact Type: | Female Socket |
Style: | Board to Board |
Number of Positions: | 23 |
Number of Positions Loaded: | All |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Rows: | 1 |
Row Spacing - Mating: | - |
Mounting Type: | Surface Mount, Right Angle |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
Insulation Color: | Black |
Insulation Height: | 0.100" (2.54mm) |
Contact Length - Post: | - |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Contact Finish - Post: | Tin |
Mated Stacking Heights: | - |
Ingress Protection: | - |
Features: | - |
Current Rating (Amps): | 3A |
Voltage Rating: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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