CONN RCPT 31POS 0.02 GOLD SMD
CONN POWER JACK SOLDER
SHUTTLE BOARD DEV KIT BMA250E
Type | Description |
---|---|
Series: | FI-R |
Package: | Tray |
Part Status: | Active |
Connector Type: | Receptacle |
Contact Type: | Female Blade Socket |
Style: | Board to Cable/Wire |
Number of Positions: | 31 |
Number of Positions Loaded: | All |
Pitch - Mating: | 0.020" (0.50mm) |
Number of Rows: | 1 |
Row Spacing - Mating: | - |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Latch Holder |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | - |
Insulation Color: | - |
Insulation Height: | 0.183" (4.65mm) |
Contact Length - Post: | - |
Operating Temperature: | -40°C ~ 80°C |
Material Flammability Rating: | UL94 V-0 |
Contact Finish - Post: | Tin |
Mated Stacking Heights: | 10.1mm, 16.1mm |
Ingress Protection: | - |
Features: | Shielded, Solder Retention |
Current Rating (Amps): | 0.8A per Contact |
Voltage Rating: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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