3.2X2.5 30PPM @25C 30PPM (-20 TO
CONN RCPT 18POS 0.05 GOLD SMD
MEMS OSC XO 2.25V-3.6V 14SMD
IC FPGA 166 I/O 240QFP
Type | Description |
---|---|
Series: | 853 |
Package: | Bulk |
Part Status: | Active |
Connector Type: | Receptacle |
Contact Type: | Female Socket |
Style: | Board to Board |
Number of Positions: | 18 |
Number of Positions Loaded: | All |
Pitch - Mating: | 0.050" (1.27mm) |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.050" (1.27mm) |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Insulation Color: | Black |
Insulation Height: | 0.207" (5.25mm) |
Contact Length - Post: | - |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Contact Finish - Post: | Tin-Lead |
Mated Stacking Heights: | - |
Ingress Protection: | - |
Features: | - |
Current Rating (Amps): | 3A |
Voltage Rating: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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