CONN RCPT 60POS 0.05 GOLD SMD
IC FPGA 333 I/O 456FBGA
Type | Description |
---|---|
Series: | CLP |
Package: | Tube |
Part Status: | Active |
Connector Type: | Receptacle, Bottom Entry |
Contact Type: | Female Socket |
Style: | Board to Board |
Number of Positions: | 60 |
Number of Positions Loaded: | All |
Pitch - Mating: | 0.050" (1.27mm) |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.050" (1.27mm) |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Insulation Color: | Black |
Insulation Height: | 0.084" (2.14mm) |
Contact Length - Post: | - |
Operating Temperature: | -55°C ~ 125°C |
Material Flammability Rating: | UL94 V-0 |
Contact Finish - Post: | Gold |
Mated Stacking Heights: | - |
Ingress Protection: | - |
Features: | Pick and Place |
Current Rating (Amps): | 3.3A per Contact |
Voltage Rating: | 240VAC, 330VDC |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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