CONN HEADER SMD 11POS 1.27MM
CONN RCPT 7POS IDC 30AWG TIN
BOLT, M3 W/M3 HEX NUT B 50PK
IC FPGA 452 I/O 1152FBGA
Type | Description |
---|---|
Series: | 850 |
Package: | Tube |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.050" (1.27mm) |
Number of Positions: | 11 |
Number of Rows: | 1 |
Row Spacing - Mating: | - |
Number of Positions Loaded: | All |
Style: | Board to Board |
Shrouding: | Unshrouded |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.118" (3.00mm) |
Contact Length - Post: | - |
Overall Contact Length: | - |
Insulation Height: | 0.087" (2.20mm) |
Contact Shape: | Circular |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Contact Material: | Brass |
Insulation Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Features: | Pick and Place |
Operating Temperature: | -55°C ~ 125°C |
Ingress Protection: | - |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating (Amps): | 1A |
Voltage Rating: | 150VDC |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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