CONN HEADER SMD 28POS 2.54MM
IC FPGA 300 I/O 676FCBGA
Type | Description |
---|---|
Series: | TSM |
Package: | Tape & Reel (TR) |
Part Status: | Active |
Connector Type: | Header |
Contact Type: | Male Pin |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions: | 28 |
Number of Rows: | 2 |
Row Spacing - Mating: | 0.100" (2.54mm) |
Number of Positions Loaded: | All |
Style: | Board to Board or Cable |
Shrouding: | Unshrouded |
Mounting Type: | Surface Mount |
Termination: | Solder |
Fastening Type: | Push-Pull |
Contact Length - Mating: | 0.230" (5.84mm) |
Contact Length - Post: | - |
Overall Contact Length: | - |
Insulation Height: | 0.100" (2.54mm) |
Contact Shape: | Square |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Finish - Post: | Tin |
Contact Material: | Phosphor Bronze |
Insulation Material: | Liquid Crystal Polymer (LCP) |
Features: | Pick and Place |
Operating Temperature: | -55°C ~ 125°C |
Ingress Protection: | - |
Material Flammability Rating: | UL94 V-0 |
Insulation Color: | Black |
Current Rating (Amps): | - |
Voltage Rating: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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