RELAY GEN PURPOSE SPDT 20A 110V
SPRING PROBE .57MM X 3.80MM HPIN
CONN BNC JACK
EVAL BOARD FOR UPC8194K
Type | Description |
---|---|
Series: | H-PIN H057 |
Package: | Bag |
Part Status: | Active |
Contact Type: | Probe Pin |
Mounting Type: | Surface Mount |
Maximum Working Height: | - |
Recommended Working Height: | 0.131" (3.34mm) |
Minimum Working Height: | - |
Pad Layout Dimension: | - |
Operating Force - Initial: | 9.4gf |
Operating Force - Mid Compression: | 30gf |
Plunger Size: | 0.130" ~ 0.370" (3.30mm ~ 9.40mm) |
Features: | - |
Mating Cycles: | 125000 |
Contact Material: | Beryllium Copper |
Contact Finish: | Gold |
Contact Finish Thickness: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
90234-ASPreci-Dip |
CONTACT SPRING LOADED SMD GOLD |
|
90147-ASPreci-Dip |
CONTACT SPRING LOADED T/H GOLD |
|
0900-0-15-20-76-14-11-0Mill-Max |
CONTACT SPRING LOADED SMD GOLD |
|
90166-ASPreci-Dip |
CONTACT SPRING LOADED SLDR CUP |
|
0922-0-15-20-75-14-11-0Mill-Max |
CONTACT SPRING LOADED T/H GOLD |
|
1593-0-57-15-00-00-03-0Mill-Max |
.093" DIAMETER TARGET DISC |
|
1559-1-57-15-00-00-03-0Mill-Max |
CONN SPRING TARGET 1POS SMD |
|
807-22-001-30-014101Mill-Max |
CONTACT SPRING LOADED SMD GOLD |
|
XP3B-3829-5050-1-T/TOmron Electronics Components |
CONTACT SPRING LOADED T/H GOLD |
|
0910-2-57-20-75-14-11-0Mill-Max |
CONTACT SPRING LOADED SMD GOLD |
|
0987-0-15-20-89-14-11-0Mill-Max |
HORIZONTAL SURFACE MOUNT (HSMT) |
|
0868-0-15-20-82-14-11-0Mill-Max |
CONTACT SPRING LOADED SLDR CUP |
|
XP3B-3029-5050-1-D/TOmron Electronics Components |
CONTACT SPRING LOADED T/H GOLD |