SOLDER 500G JAR,SN96.5 AG3.0
Type | Description |
---|---|
Series: | - |
Package: | Jar |
Part Status: | Obsolete |
Type: | Solder Paste |
Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter: | - |
Melting Point: | 423 ~ 424°F (217 ~ 218°C) |
Flux Type: | - |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Jar, 17.64 oz (500g) |
Shelf Life: | - |
Shelf Life Start: | - |
Storage/Refrigeration Temperature: | - |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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