SOLDER PASTE NXG1 NO CLEAN 1000G
Type | Description |
---|---|
Series: | NXG1 |
Package: | Bulk |
Part Status: | Obsolete |
Type: | Solder Paste |
Composition: | Sn99Cu0.7Ag0.3 (99/0.7/0.3) |
Diameter: | - |
Melting Point: | - |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Cartridge, 35.27 oz (1kg) |
Shelf Life: | 8 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
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