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70-1608-0804

70-1608-0804

SOLDER PASTE NO CLEAN 100GM

70-1608-0804

70-1608-0804

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Part No :

70-1608-0804

Manufacturer
Kester
Description
SOLDER PASTE NO CLEAN 100GM
Catalog
Solder
Availability
747774 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 29 - Jan 02 2024
PDF
70-1608-0804 PDF
Type Description
Series:R276
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 424°F (217 ~ 218°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Syringe, 3.53 oz (100g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
70-1608-0804 is available at GangBo-ic.com, Please review product page below for detailed information, including 70-1608-0804 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 70-1608-0804 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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