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SMDLTLFP500T3C

SMDLTLFP500T3C

SOLDER PASTE LOW TEMP T3 500G

SMDLTLFP500T3C

SMDLTLFP500T3C

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Part No :

SMDLTLFP500T3C

Manufacturer
Chip Quik, Inc.
Description
SOLDER PASTE LOW TEMP T3 500G
Catalog
Solder
Availability
237623 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 24 - Nov 28 2024
PDF
SMDLTLFP500T3C PDF
Type Description
Series:-
Package:Cartridge
Part Status:Active
Type:Solder Paste
Composition:Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter:-
Melting Point:281°F (138°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Cartridge, 17.64 oz (500g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 46°F (3°C ~ 8°C)
SMDLTLFP500T3C is available at GangBo-ic.com, Please review product page below for detailed information, including SMDLTLFP500T3C price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SMDLTLFP500T3C to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

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Phone: 00852-52612101

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