SOLDER PASTE LOW TEMP LF T5 10CC
IC CODE HOP ENCOD/TRNSPND 8SOIC
Type | Description |
---|---|
Series: | - |
Package: | Syringe |
Part Status: | Active |
Type: | Solder Paste |
Composition: | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter: | - |
Melting Point: | 281°F (138°C) |
Flux Type: | No-Clean |
Wire Gauge: | - |
Process: | Lead Free |
Form: | Syringe, 1.23 oz (35g), 10cc |
Shelf Life: | 6 Months |
Shelf Life Start: | Date of Manufacture |
Storage/Refrigeration Temperature: | 37°F ~ 46°F (3°C ~ 8°C) |
UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK
Office Hours : Mon-Fri, 9:00-18:30(GMT+8)
Phone: 00852-52612101
TS991AX500T4Chip Quik, Inc. |
SOLDER PASTE THERMALLY STABLE NC |
|
24-7040-8834Kester |
SOLDER FLUX-CORED/245 .020 1LB S |
|
WBNCC633732SRA Soldering Products |
NO-CLEAN FLUX CORE SOLDER, 63/37 |
|
92-7068-8860Kester |
SOLDER FLUX-CORED/245 .025" 500G |
|
WBRA633720-4OZSRA Soldering Products |
WIRE SOLDER , ROSIN ACTIVATED, 6 |
|
SMDIN52SN48Chip Quik, Inc. |
INDIUM SOLDER WIRE (IN52/SN48) 0 |
|
25-9574-7634Kester |
SOLDER FLUX-CORED/275 .093" 4LB |
|
NC191SNL250Chip Quik, Inc. |
SMOOTH FLOW LEAD-FREE SOLDER PAS |
|
RASW.015 100GChip Quik, Inc. |
SOLDER WIRE 63/37 TIN/LEAD ROSIN |
|
24-6337-6410Kester |
SOLDER FLUX-CORED/331 63/37 .062 |
|
SMDLTLFP500T3CChip Quik, Inc. |
SOLDER PASTE LOW TEMP T3 500G |
|
SMD291SNL250T3Chip Quik, Inc. |
SOLDER PASTE SAC305 250G T3 |
|
SMD3SW.031 4OZChip Quik, Inc. |
SOLDER WIRE 62/36/2 TIN/LEAD/SIL |