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70-3205-0819

70-3205-0819

SOLDER PASTE NXG1 NO CLEAN 750GM

70-3205-0819

70-3205-0819

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Part No :

70-3205-0819

Manufacturer
Kester
Description
SOLDER PASTE NXG1 NO CLEAN 750GM
Catalog
Solder
Availability
957595 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 26 - Nov 30 2024
PDF
70-3205-0819 PDF
Type Description
Series:NXG1
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 424°F (217 ~ 218°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Cartridge, 24.69 oz (700g)
Shelf Life:8 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
70-3205-0819 is available at GangBo-ic.com, Please review product page below for detailed information, including 70-3205-0819 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 70-3205-0819 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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