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SMDLTLFP250T4

SMDLTLFP250T4

SOLDER PASTE LOW TEMP T4 250G

SMDLTLFP250T4

SMDLTLFP250T4

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Part No :

SMDLTLFP250T4

Manufacturer
Chip Quik, Inc.
Description
SOLDER PASTE LOW TEMP T4 250G
Catalog
Solder
Availability
767476 pieces
Shipped from
HK warehouse
Expected Shipping Date
Dec 30 - Jan 03 2024
PDF
SMDLTLFP250T4 PDF
Type Description
Series:-
Package:Jar
Part Status:Active
Type:Solder Paste
Composition:Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter:-
Melting Point:281°F (138°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 8.8 oz (250g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:37°F ~ 46°F (3°C ~ 8°C)
SMDLTLFP250T4 is available at GangBo-ic.com, Please review product page below for detailed information, including SMDLTLFP250T4 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for SMDLTLFP250T4 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

UNIT2, 22/F., RICHMOND COMM. BLDG., 109 ARGYLE STREET, MONGKOK, KOWLOON, HK

Office Hours : Mon-Fri, 9:00-18:30(GMT+8)

[email protected]

Phone: 00852-52612101

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