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70-4006-2010

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SOLDER PASTE NO CLEAN 500GM

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70-4006-2010

70-4006-2010

Image is for reference, please contact us to get the real picture

Part No :

70-4006-2010

Manufacturer
Kester
Description
SOLDER PASTE NO CLEAN 500GM
Catalog
Solder
Availability
017301 pieces
Shipped from
HK warehouse
Expected Shipping Date
Nov 17 - Nov 21 2024
PDF
70-4006-2010 PDF
Type Description
Series:NP505-HR
Package:Bulk
Part Status:Active
Type:Solder Paste
Composition:Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter:-
Melting Point:423 ~ 424°F (217 ~ 218°C)
Flux Type:No-Clean
Wire Gauge:-
Process:Lead Free
Form:Jar, 17.64 oz (500g)
Shelf Life:6 Months
Shelf Life Start:Date of Manufacture
Storage/Refrigeration Temperature:32°F ~ 50°F (0°C ~ 10°C)
70-4006-2010 is available at GangBo-ic.com, Please review product page below for detailed information, including 70-4006-2010 price, datasheets, in-stock availability, technical difficulties. Quickly Enter the access of compare list to find replaceable electronic parts. Want to gain comprehensive data for 70-4006-2010 to optimize the supply chain (include cross references, lifecycle, parametric, counterfeit risk, obsolescence management forecasts), please contact to our Tech-supports team.

GANG BO INDUSTRIAL CO., LIMITED [Hongkong]

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